Semiconductor Devices for High-Temperature Applications: Market Opportunities

Report Code: SMC114B

Publish Date: Mar 2025

Publisher: BCC Publishing

Category: Semiconductors

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Report Highlights

The global market for semiconductor devices for high-temperature applications is estimated to increase from $11.8 billion in 2024 to reach $18.5 billion by 2029, at a compound annual growth rate (CAGR) of 9.4% from 2024 through 2029.

Report Includes

  • 59 data tables and 54 additional tables
  • An analysis of the global market for semiconductor devices for high-temperature applications
  • Analyses of the global market trends, with data from 2023, estimates for 2024, forecasts for 2025 and 2026, and projections of compound annual growth rates (CAGRs) through 2029
  • Evaluation of the market potential for semiconductor devices for high- temperature applications, industry growth drivers, and forecasts for this market’s segments and sub-segments
  • Estimates of the actual market size and revenue forecast for the global market for semiconductor devices for high-temperature applications, and a corresponding market share analysis by material type, device type, operating temperature, industry and region
  • Description of gallium nitride (GaN), silicon carbide (SiC) and gallium arsenide (GaAs); their products and applications
  • Discussion of the market dynamics and shifts, and the regulations, industry challenges, and macroeconomic factors affecting the demand for semiconductor devices for high-temperature applications
  • Discussion on the industry’s ESG challenges and practices
  • Identification of the companies that are best positioned to meet this demand because of their proprietary technologies, strategic alliances or other advantages
  • Insights into the industry structure for semiconductor devices for high-temperature applications, and the competitive landscape
  • Company profiles of major players within the industry, including Infineon Technologies AG, NXP Semiconductors, TDK Corp., Wolfspeed Inc., and Allegro MicroSystems LLC.

Report Scope

This report provides an overview of the global semiconductor devices for high-temperature applications market and analyzes market trends. It provides the global revenue (in $ millions) for segments and regions, considering 2023 as the base year, with estimated market data for 2024 through 2029. The market is based on materials, device types, operating temperatures, industries and regions. Geographical segments covered are North America (U.S., Canada, Mexico), Europe (U.K., Germany, France, Italy, Rest of Europe), Asia-Pacific (China, Japan, South Korea, Rest of Asia-Pacific) and the Rest of the World (RoW), which includes South America, Middle East and Africa. The report also focuses on emerging technologies and vendor landscape. It concludes with profiles of the major players in the market.

Report Synopsis

Report Metrics Details
Base year considered 2023
Forecast period considered 2024-2029
Base year market size $10.9 billion
Market size forecast $18.5 billion
Growth rate CAGR of 9.4% for the forecast period of 2024-2029
Units considered $ Millions
Segments covered Materials, Device Types, Operating Temperature, Industry
Regions covered North America, Europe, Asia-Pacific, Rest of the World
Countries covered U.S., Canada, Mexico, Italy, Germany, U.K., France, Spain, the Netherlands, China, Japan, South Korea, India, Australia, New Zealand, South America, Middle East and Africa
Key Market Drivers
  • Emergence of UWBG Materials
  • Growing Demand for High-Temperature Electronics
  • Growing Demand for Electric Aircraft and EVs
Companies studied
ANALOG DEVICES INC.ALLEGRO MICROSYSTEMS INC.
CISSOIDFUJITSU
GENERAL ELECTRIC CO.HONEYWELL INTERNATIONAL INC.
INFINEON TECHNOLOGIES AGLATTICE SEMICONDUCTOR
MITSUBISHI ELECTRIC CORP.NXP SEMICONDUCTORS
QORVO INC.RENESAS ELECTRONICS CORP.
RTXTDK CORP.
TEXAS INSTRUMENTS INC.TOSHIBA CORP.
WOLFSPEED INC.
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Frequently Asked Questions (FAQs)

The global market for semiconductor devices for high-temperature applications was valued at $10.9 billion in 2023 and will reach $18.5 billion by 2029, growing at a CAGR of 9.4% from 2024 to 2029.
The key factors driving the global semiconductor devices for high-temperature applications market are the emergence of III-V Materials consisting of silicon carbide, gallium nitride, and others. Additionally, growing demand for high-temperature electronics across industries such as industrial and instrumentation, automotive, and energy and power further boosts the market growth.
By the end of 2029, the automotive and industrial and instrumentation segment will continue to dominate the global semiconductor devices for high-temperature applications market, owing to the higher adoption of these devices across these industries that demand high operating temperatures.
The Asia-Pacific region is the leading revenue generator for the global semiconductor devices for high-temperature applications market. In 2023, it accounted for $6.5 billion in revenue, representing about 59.7% worldwide. North America and Asia-Pacific are key markets, with significant growth potential driven by major industry players deriving substantial revenue from these regions, substantial government investments in the defense sector, and increasing electric vehicles demand, especially across China. Additionally, growing industrial sector is also expected to boost the market.
The key companies/players in the market include Infineon Technologies AG, NXP Semiconductors, TDK Corp., Wolfspeed, Inc., and Allegro MicroSystems LLC among others.

Analyst Credentials

BCC Research Team possesses expertise and experience in life and physical science domains. They specialize in offering valuable business insights, including industry analysis, competitor intelligence, strategic and financial analysis, and opportunity assessment. The team has in-depth knowledge of various sectors, including healthcare, biotechnology, pharmaceuticals, IT, automation, advanced materials, and energy. They are proficient in qualitative and quantitative market intelligence providing clients with actionable insights. With a vast understanding of the competitive landscape, the team can support clients in making data-driven decisions to help them achieve a competitive edge in their respective markets.

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Table of Contents

All reports provided in PDF format. For shared licensing options (5+ Users), please call a representative at (+1) 781-489-7301 or contact us at info@bccresearch.com
Title/Chapter NamePagesMember Price
Full Report: Semiconductor Devices for High-Temperature Applications: Market Opportunities141Free
Chapter- 1: Executive Summary5Free
Chapter- 2: Market Overview9Free
Chapter- 3: Market Dynamics 6Free
Chapter- 4: Emerging Trends and Technologies5Free
Chapter- 5: Market Segmentation Analysis38Free
Chapter- 6: Competitive Intelligence5Free
Chapter- 7: Sustainability in the Semiconductor Devices for High-Temperature Applications Industry: An ESG Perspective 5Free
Chapter- 8: Appendix68Free
Published - May-2019| Analyst - Sinha G. Gaurav| Code - SMC114A

Report Highlights

The global market for semiconductor devices for high-temperature applications should grow from $3.9 billion in 2018 to $9.4 billion by 2023 with a compound annual growth rate (CAGR) of 19.2% for the period of 2018-2023.

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Semiconductor Devices for High-Temperature Applications: Market Opportunities
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