Global Chiplets Market

Report Code: SMC137A

Publish Date: Dec 2024

Publisher: BCC Publishing

Category: Semiconductors

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Report Highlights

This report assesses the chiplets market by processor, packaging technology, end-user, and regions. It also analyzes related companies and service providers. The report also discusses market dynamics, such as drivers, opportunities, and restraints. The study forecasts the market value ($ million) of chiplets for key geographies. The report also focuses on the key emerging technologies that will fuel their adoption in the near future.

Report Includes

  • In-depth assessment of the global market for semiconductor chiplets
  • Analyses of global market trends, with market revenue data for 2023, estimates for 2024, forecasts for 2025 and 2027, and projected CAGRs through 2029
  • Estimates of the market size and revenue growth prospects, along with a market share analysis by processor type, packaging technology, end use (application) industry and region
  • Facts and figures pertaining to the market dynamics, technical advances, regulations, and the impact of macroeconomic factors
  • Analysis of the industry structure, including companies’ market shares and rankings, strategic alliances, M&A activities, and a venture funding outlook
  • Company profiles

Report Scope

This report offers a comprehensive analysis of chiplets, with a focus on five processor segments: CPUs, GPUs, field-programmable gate arrays (FPGAs), AI-application-specific integrated circuit (AI-ASIC) coprocessors and application processing units (APUs). The report further segments the market by packaging technology, specifically 2.5D/3D, system-in-package (SiP), wafer-level chip-scale package (WLCSP), flip chip chip-scale package (FCCSP), flip chip ball grid array (FCBGA) and fan-out (FO). In addition, the chiplet market is segmented by end users: enterprise electronics, consumer electronics, industrial automation, automotive, healthcare, military and aerospace. The use of chiplets in other sectors, such as IT and telecommunication, scientific research and gaming, is also analyzed. Regions covered include North America, Europe, Asia-Pacific and the rest of the world (RoW), which includes Latin America, the Middle East and Africa.

The study also analyzes the key drivers, macroeconomic factors and regional dynamics of the chiplet market. The report concludes by providing profiles of the leading chiplet manufacturers. The base year for the study is 2023, with market forecasts for 2024 through 2029, including projections of the compound annual growth rates (CAGRs) for the forecast period 2024–2029.

Report Synopsis

Report Metrics Details
Base year considered 2023
Forecast period considered 2024-2029
Base year market size $5.3 billion
Market size forecast $42.8 billion
Growth rate CAGR of 41.9% for the forecast period of 2024-2029
Units considered $ Millions
Segments covered Processor Type, Packaging Technology, End Use Industry and Region
Regions covered North America, Europe, Asia-Pacific, and Rest of the World (RoW)
Countries covered U.S., Canada, U.K., Germany, France, Italy, China, Taiwan, Japan, South Korea, India, and Latin America
Key Market Drivers
  • High-performance computing.
  • 5G’s growing need for chiplets
Companies studied
ACHRONIX SEMICONDUCTOR CORP.ADVANCED MICRO DEVICES INC.
BROADCOMGLOBALFOUNDRIES INC.
IBM CORP.INTEL CORP.
NVIDIA CORP.RANOVUS
SAMSUNGTAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
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Frequently Asked Questions (FAQs)

The global market for chiplets was valued at $5.3 billion in 2023 and will reach $42.8 billion by 2029, growing at a CAGR of 41.9% from 2024 to 2029.
The key factors driving the global chiplets market growth include growth in high-performance computing and 5G’s growing need for chiplets.
By the end of 2029, the enterprise electronics end-user segment will continue to dominate the global chiplets market.
The Asia-Pacific region has the highest market share in the global chiplets market.
The key companies/players in the market include Intel Corporation, Advanced Micro Devices Inc. (AMD), Taiwan Semiconductor Manufacturing Company Limited (TSMC), NVIDIA Corporation, Samsung Electronics Co. Ltd., and GLOBALFOUNDRIES among others.

Analyst Credentials

BCC Research Team possesses expertise and experience in life and physical science domains. They specialize in offering valuable business insights, including industry analysis, competitor intelligence, strategic and financial analysis, and opportunity assessment. The team has in-depth knowledge of various sectors, including healthcare, biotechnology, pharmaceuticals, IT, automation, advanced materials, and energy. They are proficient in qualitative and quantitative market intelligence providing clients with actionable insights. With a vast understanding of the competitive landscape, the team can support clients in making data-driven decisions to help them achieve a competitive edge in their respective markets.

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Table of Contents

All reports provided in PDF format. For shared licensing options (5+ Users), please call a representative at (+1) 781-489-7301 or contact us at info@bccresearch.com
Title/Chapter NamePagesMember Price
Full Report: Global Chiplets Market84Free

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Global Chiplets Market

Published - Dec 2024 | Publisher - BCC Publishing | Code - SMC137A

This report assesses the chiplets market by processor, packaging technology, end-user, and regions. It also analyzes related companies and service providers. The report also discusses market dynamics, such as drivers, opportunities, and restraints. The study forecasts the market value ($ million) of chiplets for key geographies. The report also focuses on the key emerging technologies that will fuel their adoption in the near future.

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