Report Highlights
The global market for resins used in electronic components reached 3.4 billion pounds in 2011. It is expected to reach 3.5 billion pounds in 2012 and it will further grow to 4.4 billion pounds by 2017, a compound annual growth rate (CAGR) of 4.7%.
SCOPE AND FORMAT
This study covers all electronic components where plastics are used to a significant extent in mostly molding electronic components and excludes fiber optics, wire and cable, enclosures, recording media, etc. This study covers single devices (e.g., connectors, capacitors, switches, bobbins), multiple-component devices (e.g., printed circuit boards, interconnects, etc.) and encapsulants.
In addition, key participants in the electronic components industry in terms of resin producers, and molders are identified along with inclusion of key technologies, and the competitive resin scenario.
Analyst Credentials
Melvin Schlechter has thirty years of experience in the chemical industry, specializes in plastics market research and has been a BCC Research analyst for since 2006. Previously, Mr. Schlechter was the International Director of Chemical Reports for Frost & Sullivan. He also worked for the Union Carbide Company as a Senior Market Research Analyst, was a Senior Organic/Polymer Chemist for Stauffer Chemical Company and a Research Organic Chemist for Allied Signal Corporation. Mr. Schlechter holds a B.S. in Chemistry from Queens College, a Masters in Organic Chemistry from Virginia Tech, and an MBA from Adelphi University.
Report Highlights
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Thermoplastic and thermoset volumes, estimated at slightly over 586 million pounds in 2006 should reach over 700 million pounds by 2011 corresponding to an annual growth rate of 4.3%.
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Thermoplastics will have the highest growth rate through the forecast period at 4.8%. Consumption is almost 400 million pounds in 2006 and should grow to just over 500 million pounds in 2011.
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In terms of technology driven factors, miniaturization is still an important factor, although it is beginning to reach its saturation point; thinwalling of molded parts; and higher soldering temperatures due to surface mount technologies (SMT) and lead-free soldering have been some of the key parameters affecting choices and volumes of plastics being used to mold components. These factors will drive the use for resins with higher heat deflection temperatures (HDTs) and glass transition temperatures (Tgs) and lower dielectric constants.
Report Highlights
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The total annual consumption of plastics in electronic components in North America was just over 415 million pounds in 2001 and will rise at an AAGR (average annual growth rate) of 3.9% to 503 million pounds in 2006.
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Thermoplastics account for 65% of the market, and growing at a higher AAGR of 4.8% will take nearly 68% in 2006.
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Thermosets will rise at an AAGR of just 2.2% from 145 million pounds to 162 million pounds.
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Three specific applications, namely PCB laminates, encapsulation, and connector molding account for more than 80% of total market volume of the market.
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Nearly 57% of plastics are consumed in stationary computers and peripherals, a number that will dip slightly by 2006.
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The share for portable applications will rise from 7.1% in 2001 to 11.1% in 2006.
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