The Market for Thermal Management Technologies

The global market for thermal management products is expected to grow from about $10.1 billion in 2013 to $10.6 billion in 2014 and $14.7 billion by 2019, a compound annual growth rate (CAGR) of 6.8% between 2014 and 2019.

The market for thermal management technologies was valued at $6.7 billion in 2011 and reached $7 billion in 2012. Total market value is expected to reach $10.1 billion in 2017 after increasing at a five-year compound annual growth rate (CAGR) of 7.6%.

The world market for thermal management products will grow from about $7.5 billion in 2010 to $8 billion in 2011 and $10.9 billion by 2016, a compound annual growth rate (CAGR) of 6.4% between 2011 and 2016.

• The world market for thermal management products will grow from about $6.9 billion in 2009 to $7.5 billion in 2010 and $10.2 billion by 2015, a compound annual growth rate (CAGR) of 6.4% between 2010 and 2015.
  
• Asia-Pacific is projected to be the fastest-growing region, with a compound annual growth rate (CAGR) of 7.3% between 2010 and 2015. This region is valued at $1.7 billion in 2010 and should reach $2.5 billion by 2015.
  
• The market in the Americas is projected to grow from $2.9 billion in revenues in 2010 to $4 billion in 2015, a compound annual growth rate (CAGR) of 6.7%. 

• The global market for thermal management technologies increased from $6.2 billion in 2007 to an estimated $6.8 billion by the end of 2008. It should reach $11.1 billion by 2013, a compound annual growth rate (CAGR) of 10.3%.
• Thermal management hardware accounts for more than 80% of the total thermal management market.
• The largest end-markets for thermal management technologies in 2007 were the computer industry (57% of total revenues) and telecommunications (16%). By 2013, medical and office electronics should move into a tie for second place with telecommunications, each with a 12% market share.
   
   

• The world market for thermal management products will grow from about $4.1 billion in 2005 to $4.4 billion in 2006, and approach $6.7 billion by 2011.
• By 2011, medical and office electronics should have moved into third place behind telecom applications, with a 16% market share, followed by consumer electronics with an 11% share.
• The Asia-Pacific countries (except Japan) have the highest projected growth rate. By 2011, the Asia-Pacific region is expected to account for nearly a quarter of the market, pulling further ahead of Japan.

• The world market for thermal management products will rise from about $3.3 billion in 2003 to $5.9 billion by 2008, at an average annual growth rate (AAGR) of 12.1%.
• Revenue growth slowed in 1990s with the downturn in the computer industry, and with suppliers experiencing severe commodity pricing pressures.
• The current thermal management market has been rekindled with new design starts, and the emergence of new applications that require completely new cooling solutions.
• The 2+ GHz desktop computer, prolific growth of handheld devices and integrated Internet connectivity, the demand for wireless base stations and large Internet infrastructure equipment all present new challenges.

• This new study estimates that the world market for this mix of products that dissipate excess heat in electronic systems will grow from about $3.25 billion in 2000 to $6 billion by 2005, at an average annual growth rate (AAGR) of 13%.
• The report's forecast of a 13% AAGR reflects the return of growth to the electronics markets. During its slow years, the thermal management industry had introduced many improvements in the thermal handling capability of products. There had also been the development of highly efficient, high-yield manufacturing methods - the adoption of which had been put on hold until recently.
• The new materials and components that are now available for next-generation applications are already expanding the definition of efficiency in electronics. Once employed only as a means to prevent thermal failure, thermal management technology will be in demand throughout the forecast period, research indicates, because it can improve the performance of super-fast, high-power and high-temperature electronics systems.